Thermal Mechanical Test Engineer, Silicon Packaging (starlink)

SpaceX is seeking a Thermal Mechanical Test Engineer for Silicon Packaging on the Starlink team. This role involves developing and executing thermal and mechanical modeling and test programs for semiconductor packaging and board-level assemblies. Responsibilities include creating finite element models, thermal simulations, process models, and designing/executing test campaigns.

Skills and focus areas

• thermal analysis
• mechanical analysis
• finite element modeling
• thermal simulation
• semiconductor packaging
• board-level assembly
• test engineering
• process modeling
• data analysis
• correlation