[ engineering ]
Substrate Ic Package Layout Design Engineer
Etched- Location
- Not specified
- Work mode
- On-site
- Type
- full time
- Listed
Applications go directly to Etched. Ramai takes no fee for placement and no money for ranking.
[ About this role ]
Substrate IC Package Layout Design Engineer at Etched responsible for end-to-end design of complex IC substrate packages. This role involves designing large substrate designs (>50mm), complex power delivery networks, and high-speed signaling solutions (up to and beyond 50GHz) for high-power AI processors and accelerators.
Skills and focus areas
- ic substrate layout design
- power delivery network design
- high-speed signal routing
- signal integrity
- power integrity
- advanced packaging
- cowos integration
Summary written by Ramai from the original posting. Full details and requirements are on Etched’s careers page.
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