[ engineering ]
Substrate Ic Package Layout Design Engineer
Etched- Location
- Not specified
- Work mode
- On-site
- Type
- full time
- Listed
Applications go directly to Etched. Ramai takes no fee for placement and no money for ranking.
[ About this role ]
Substrate IC Package Layout Design Engineer at Etched. This role focuses on the end-to-end design of complex IC substrate packages for high-power consumption and high-speed signaling. Responsibilities include leading substrate layout design, ensuring robust power delivery for custom silicon solutions, and developing high-speed signal routing solutions.
Skills and focus areas
- ic substrate layout design
- high-power ai processors
- accelerators
- large substrate designs (>50mm)
- multi-layer substrate packages
- high pin counts
- dense routing
- power delivery design
- custom silicon solutions (>700w)
- high-speed signal routing
- signal integrity
- power integrity
Summary written by Ramai from the original posting. Full details and requirements are on Etched’s careers page.
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