Senior Principal Engineer, Global Product Management - Advanced Packaging
Assembly- Location
- Us > Arizona > Phoenix
- Work mode
- Hybrid
- Type
- full time
- Listed
Applications go directly to Assembly. Ramai takes no fee for placement and no money for ranking.
[ About this role ]
Senior Principal Engineer, Global Product Management in Advanced Packaging. This role involves leading product lifecycle management from concept to end-of-life, defining and maintaining product roadmaps for emerging advanced packaging applications, and collaborating with semiconductor manufacturers and cross-functional teams to commercialize differentiated solutions.
Skills and focus areas
- product lifecycle management
- product roadmap development
- advanced packaging
- heterogeneous integration
- chiplet architectures
- interconnect solutions
- hybrid bonding
- 2.5d/3d integration
- hbm
- customer engagement
- market analysis
- business growth
Summary written by Ramai from the original posting. Full details and requirements are on Assembly’s careers page.
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