Senior Engineer, Process Engineering
Assembly- Location
- Singapore
- Work mode
- On-site
- Type
- full time
- Listed
Applications go directly to Assembly. Ramai takes no fee for placement and no money for ranking.
[ About this role ]
Senior Process Engineer in Advanced Packaging to contribute to semiconductor process development for next-generation devices. Responsibilities include research, development, and optimization of thin-film deposition and surface preparation technologies, experimental design and analysis, and collaboration with cross-functional teams.
Skills and focus areas
- process engineering
- semiconductor
- advanced packaging
- thin-film deposition
- surface preparation
- ald
- pecvd
- pvd
- ecp
- doe
- experimentation
- characterization
Summary written by Ramai from the original posting. Full details and requirements are on Assembly’s careers page.
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