Director, Technical (advanced Packaging)
Assembly- Location
- South Korea > Icheon
- Work mode
- On-site
- Type
- full time
- Listed
Applications go directly to Assembly. Ramai takes no fee for placement and no money for ranking.
[ About this role ]
The Technical Director, Advanced Package is a strategic business and technology leader focused on ASM's business at SK Hynix. This role requires deep expertise in semiconductor technology, particularly advanced packaging, to build customer relationships and lead global service, support, and process engineering teams.
Skills and focus areas
- semiconductor technology
- advanced packaging
- customer relationship management
- process engineering
- account management
- product strategy
- technical communication
- stakeholder management
Summary written by Ramai from the original posting. Full details and requirements are on Assembly’s careers page.
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Advanced manufacturing and distribution solutions (for China-based…
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