[ engineering ]
Advanced Packaging Si/pi Engineer
Etched- Location
- Not specified
- Work mode
- On-site
- Type
- full time
- Listed
Applications go directly to Etched. Ramai takes no fee for placement and no money for ranking.
[ About this role ]
Etched is hiring an Advanced Packaging Si/Pi Engineer to be responsible for the electrical performance of their AI accelerator platform across silicon, package, and board. The role involves SI/PI analysis, driving SI requirements into layout, and owning PDN design and decoupling strategy.
Skills and focus areas
- signal integrity
- power integrity
- advanced packaging
- high-power package design
- board design
- power delivery networks
- high-speed signaling
- 2d packaging
- 2.5d packaging
- 3d packaging
- substrate layout
- interposer layout
Summary written by Ramai from the original posting. Full details and requirements are on Etched’s careers page.
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